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PL130-07AQC

PL130-07AQC

PL130-07AQC

Microchip Technology

1 Circuit 200MHz 1:1 Clock Buffer QUAD 16-VFQFN Exposed Pad

SOT-23

PL130-07AQC Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 16-VFQFN Exposed Pad
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tube
Published 2016
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2 (1 Year)
Number of Terminations 16
Type Buffer/Driver
Voltage - Supply 2.5V~3.3V
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1
Terminal Pitch 0.5mm
Output LVCMOS
Supply Voltage-Max (Vsup) 3.3V
Supply Voltage-Min (Vsup) 2.5V
Number of Circuits 1
Frequency (Max) 200MHz
Input LVCMOS, Sine Wave
Ratio - Input:Output 1:1
Differential - Input:Output No/No
Height Seated (Max) 0.95mm
Length 3mm
Width 3mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2.85000 $2.85
25 $2.37920 $59.48
PL130-07AQC Product Details

PL130-07AQC Overview


A 16-VFQFN Exposed Pad case is used for packaging. It's?packaged?in?the?form?of?a Tube. Under normal circumstances, 200MHz is the maximum value. A total of 16 terminations have been found in it. In this case, it will be mounted by Surface Mount. The electrical component has a classification of Buffer/Driver. Setting the temperature to 0°C~70°C will ensure reliable performance. This circuit clock should be able to operate on a power supply of 2.5V~3.3V volts. There is an output of LVCMOS. Vsup is set to 3.3V as the maximum supply voltage. As a general rule, the supply voltage (Vsup) should be maintained above 2.5V.

PL130-07AQC Features


16 terminations
The operating temperature of 0°C~70°C degrees

PL130-07AQC Applications


There are a lot of Microchip Technology PL130-07AQC Clock Buffers & Drivers applications.

  • Furniture
  • Data center
  • Industrial automation control system
  • Other PCIe Gen2 networking applications
  • Window comparator
  • DDR4 JEDEC standard RDIMM design
  • Information equipment
  • Cloud computing
  • High speed instrument
  • Network attached storage

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