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PL130-07AQC-R

PL130-07AQC-R

PL130-07AQC-R

Microchip Technology

1 Circuit 200MHz 1:1 Clock Buffer QUAD 16-VFQFN Exposed Pad

SOT-23

PL130-07AQC-R Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-VFQFN Exposed Pad
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
Type Buffer/Driver
Voltage - Supply 2.5V~3.3V
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1
Terminal Pitch 0.5mm
Output LVCMOS
Supply Voltage-Max (Vsup) 3.3V
Supply Voltage-Min (Vsup) 2.5V
Number of Circuits 1
Frequency (Max) 200MHz
Input LVCMOS, Sine Wave
Ratio - Input:Output 1:1
Differential - Input:Output No/No
Height Seated (Max) 0.8mm
Length 3mm
Width 3mm
RoHS Status ROHS3 Compliant
PL130-07AQC-R Product Details

PL130-07AQC-R Overview


As far as the case type is concerned, the cut smart buffer is available in 16-VFQFN Exposed Pad. A Tape & Reel (TR) is used to package it. It is recommended that the maximum value for normal operation is 200MHz. A total of 16 terminations are present in it. In this case, it is set up as Surface Mount. There is a classification of Buffer/Driver for this electronic part. It is recommended to set the temperature to 0°C~70°C in order to ensure reliable performance. This circuit clock should be able to operate on a power supply of 2.5V~3.3V volts. In the direction of Surface Mount, it is placed. Buffer IC is LVCMOS that is output. The maximum supply voltage (Vsup) is set to 3.3V. It is recommended to keep the supply voltage (Vsup) above 2.5V to ensure normal operation.

PL130-07AQC-R Features


16 terminations
The operating temperature of 0°C~70°C degrees

PL130-07AQC-R Applications


There are a lot of Microchip Technology PL130-07AQC-R Clock Buffers & Drivers applications.

  • Medical instruments
  • Consumer Electronics
  • High speed line receiver
  • Network
  • High-speed flip-flop
  • Tower server
  • DDR4 JEDEC standard LRDIMM design
  • OTN
  • Internet of Things
  • High reliability telecommunication system

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