PowerPC 603e Microprocessor -- Series TSPC603 255-BCBGA Exposed Pad
SOT-23
TSPC603RVGS12LC Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
255-BCBGA Exposed Pad
Supplier Device Package
255-CI-CGA (21x21)
Product Status
Obsolete
Mfr
Microchip Technology
Base Product Number
TSPC603
Package
Tray
Series
--
Published
2005
Packaging
Tray
Operating Temperature
-40°C~110°C TC
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
TSPC603
Speed
266MHz
Core Processor
PowerPC 603e
Voltage - I/O
3.3V
Ethernet
--
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
--
USB
--
Additional Interfaces
--
Co-Processors/DSP
--
Security Features
--
Display & Interface Controllers
--
SATA
--
RoHS Status
Non-RoHS Compliant
TSPC603RVGS12LC Product Details
TSPC603RVGS12LC Overview
With a packing size of 255-BCBGA Exposed Pad, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~110°C TC. A -- series item. A PowerPC 603e processor is present in this CPU. The CPU contains -- RAM controllers. This microprocessor is equipped with an interface of --. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with TSPC603. A supplier offers a 255-CI-CGA (21x21) package.
TSPC603RVGS12LC Features
PowerPC 603e Core
TSPC603RVGS12LC Applications
There are a lot of Microchip Technology TSPC603RVGS12LC Microprocessor applications.