PowerPC 603e Microprocessor -- Series TSPC603 255-BCBGA Exposed Pad
SOT-23
TSPC603RVGU12LC Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
255-BCBGA Exposed Pad
Mounting Type
Surface Mount
Supplier Device Package
255-CBGA (21x21)
Product Status
Obsolete
Mfr
Microchip Technology
Base Product Number
TSPC603
Package
Tray
Series
--
Published
2005
Packaging
Tray
Operating Temperature
-40°C~110°C TC
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
TSPC603
Speed
266MHz
Core Processor
PowerPC 603e
Voltage - I/O
3.3V
Ethernet
--
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
--
USB
--
Additional Interfaces
--
Co-Processors/DSP
--
Security Features
--
Display & Interface Controllers
--
SATA
--
RoHS Status
Non-RoHS Compliant
TSPC603RVGU12LC Product Details
TSPC603RVGU12LC Overview
The embedded microprocessor has been packed in 255-BCBGA Exposed Pad for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around -40°C~110°C TC is determined. This is a member of the -- series. With a core count of PowerPC 603e, this CPU is multicore. A CPU with this architecture uses -- RAM controllers. With its -- interfaces, this microprocessor will be able to serve you better. The CPU runs at 3.3V when it comes to I/O. Use TSPC603 when searching for variants of the embedded microprocessor. Suppliers are offering 255-CBGA (21x21) packages.
TSPC603RVGU12LC Features
PowerPC 603e Core
TSPC603RVGU12LC Applications
There are a lot of Microchip Technology TSPC603RVGU12LC Microprocessor applications.