32 TerminationsUPD1001 Specialized Power Management ICs
SOT-23
UPD1001T-AI/MQ Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
5 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
32-VFQFN Exposed Pad
Operating Temperature
-40°C~85°C
Packaging
Tape & Reel (TR)
Published
2004
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
32
Terminal Finish
Matte Tin (Sn) - annealed
Applications
USB, Peripherals
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
QUAD
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
5V
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
UPD1001
JESD-30 Code
S-XQCC-N32
Supply Voltage-Max (Vsup)
5.3V
Supply Voltage-Min (Vsup)
3.1V
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Height Seated (Max)
1mm
Length
5mm
Width
5mm
RoHS Status
ROHS3 Compliant
UPD1001T-AI/MQ Product Details
UPD1001T-AI/MQ Overview
Tape & Reel (TR) is acceptable for shipping the power management.For ease of transportation, it is packaged the power management in 32-VFQFN Exposed Pad .The Surface Mount mounting method facilitates easy adaptation.It targets applications such as USB, Peripherals and others.Keeping the operating temperature of the power management ic -40°C~85°C will prevent malfunctions.To find more power ic's pin-to-pin solutions, try searching UPD1001 .The power management is equipped with 32 terminals.A Surface Mount is provided for mounting on a PCB or other board.The power manager can perform numerous demanding tasks when supplied with 5V voltage.In order for the ic supplies to begin working, it must have at least 3.1V .There is no need to supply the power supply ic with voltage greater than 5.3V .
UPD1001T-AI/MQ Features
Mainly used in USB, Peripherals applications Operating temperature: -40°C~85°C
UPD1001T-AI/MQ Applications
There are a lot of Microchip Technology UPD1001T-AI/MQPower Management applications.