0.4mm Specialized Interface IC USB2227 128 Pin 1.8V 128-TQFP
SOT-23
USB2227-NU-11 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
7 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
128-TQFP
Number of Pins
128
Packaging
Tray
Published
2002
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
128
Terminal Finish
Matte Tin (Sn) - annealed
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Applications
Controller
HTS Code
8542.31.00.01
Technology
CMOS
Voltage - Supply
3.3V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
0.4mm
Time@Peak Reflow Temperature-Max (s)
40
Base Part Number
USB2227
Pin Count
128
Temperature Grade
COMMERCIAL
RAM Size
768B
Drive Interface Standard
IDE
Host Interface Standard
USB
Length
14mm
Height Seated (Max)
1.2mm
Width
14mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$2.875198
$2.875198
10
$2.712450
$27.1245
100
$2.558916
$255.8916
500
$2.414071
$1207.0355
1000
$2.277425
$2277.425
USB2227-NU-11 Product Details
USB2227-NU-11 Overview
It's a good fit for the 128-TQFP package.It comes in a Tray case.This component is installed in the way of Surface Mount.It is appropriate for the component applied in Controller.The device is capable of supplying 3.3V volts.It is possible to find related parts based on the USB2227.There are 128 terminations on it.Keep in mind that this device should be set to 1.8V.There are a total of 128 pins on it.128 pins are used for operation.It is mounted by Surface Mount.It operates at a minimum working temperature of 0°C to ensure reliability.The maximum value of 70°C assures that the part runs consistently.
USB2227-NU-11 Features
It is based on USB2227. Set the part at 1.8V volts
USB2227-NU-11 Applications
There are a lot of Microchip Technology USB2227-NU-11 Specialized Interface ICs applications.