VSC7420XJQ-02 Overview

The TQFP package reduces the amount of space on a board.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount mounting type is used.1 circuits make up this telecom IC .When 1V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the SparX?-III-10um series.For normal operation, the temperature is set at 0°C minimum.It is necessary to set the temperature at the maximum value of 125°C for the telecom IC to function normally.

VSC7420XJQ-02 Features

Available in the TQFP package

VSC7420XJQ-02 Applications

There are a lot of Microchip Technology VSC7420XJQ-02 Telecom applications.

• ISDN Primary Rate Interface
• E3/DS3 Access Equipment
• ISDN Primary Rate Interfaces (PRA)
• Central office
• Digital cross connects (DSX-1)
• Codec function on telephone switch line cards
• Hybrid fiber coax (HFC)
• Switching Systems
• Router
• Integrated Access Devices