VSC7421XJQ-02 Overview

TQFP package is used to save board space.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.This telecom IC is composed of 1 circuits.1V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The SparX?-III-17um series is capable of providing a number of similar functions to the W series.Normal operation is ensured by setting 0°C to a minimum value.It is necessary to set the temperature at the maximum value of 125°C for the telecom IC to function normally.

VSC7421XJQ-02 Features

Available in the TQFP package

VSC7421XJQ-02 Applications

There are a lot of Microchip Technology VSC7421XJQ-02 Telecom applications.

• ISDN terminal adapter
• T1 Digital Cross Connects (DSX-1)
• Short/Medium Loop
• PCM Test Equipment
• CSU/DSU E1/T1/J1 Interface
• Interfaces to E3
• Fiber in the loop (FITL)
• T1/E1/J1 Performance Monitoring
• High speed data transmission line cards
• Integrated Multi-Service Access Platforms (IMAPs)