VSC7421XJQ-04

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Manufacturer part number:VSC7421XJQ-04

Manufacturer:Microchip Technology

Description:Telecom device1 Circuits

Case Package:SOT-23

Datasheet:VSC7421XJQ-04 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Lifecycle Status	NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago)
Mounting Type	Surface Mount
Package / Case	TQFP
Supplier Device Package	302-TQFP (24x24)
Packaging	Tray
Series	SparX™-III-17um
Part Status	Not For New Designs
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Max Operating Temperature	125°C
Min Operating Temperature	-40°C
Voltage - Supply	1V
Function	Ethernet Switch
Interface	Serial
Number of Circuits	1
Data Rate	1 Gbps
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

Quantity	Unit Price	Ext. Price
1	$55.00000	$55
10	$51.76400	$517.64
25	$48.52840	$1213.21
100	$46.26380	$4626.38

VSC7421XJQ-04 Overview

TQFP package is used to save board space.Packing is done according to the Tray method.The mounting type is Surface Mount.The telecom IC is composed of 1 circuits.Improved efficiency can be ensured when the supply voltage of 1V is provided.This part can perform many functions similar to the electronic parts under the SparX?-III-17um series.To ensure normal operation, -40°C must be set at a minimum value.Normal operation is ensured by setting 125°C to the maximum value.