VSC8531XMW Overview

Saving board space is achieved with the 48-VFQFN Exposed Pad package.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.Telecommunications equipment consists of 1 circuits.At -40°C~125°C, reliable performance can be achieved.

VSC8531XMW Features

Available in the 48-VFQFN Exposed Pad package

VSC8531XMW Applications

There are a lot of Microchip Technology VSC8531XMW Telecom applications.

• Short/Medium Loop
• Network Multiplexing and Terminating Equipment
• T1 Digital Cross Connects (DSX-1)
• Digital cross connects (DSX-1)
• CSU/DSU E1/T1/J1 Interface
• E2 Rates PCM Line Interface
• Frame Relay Switches and Access Devices (FRADS)
• High speed data transmission line cards
• SDH Multiplexers
• High-Density T1/E1/J1 interfaces for Multiplexers