VSC8564XKS-14 Overview

256-BGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.

VSC8564XKS-14 Features

Available in the 256-BGA package

VSC8564XKS-14 Applications

There are a lot of Microchip Technology VSC8564XKS-14 Telecom applications.

• DECT (Digital European Cordless Telephone) Base
• Digital access cross connects
• Interfaces to SONET STS-1 Networks
• ISDN terminal adapter
• Digital loop carrier (DLC)
• Intelligent PBX
• High-Density T1/E1/J1 interfaces for Multiplexers
• Residential Gateways
• Integrated Access Devices
• T1/E1/J1 add/drop multiplexers (MUX)