VSC8572XKS-05 Overview

The 256-BGA package reduces the amount of space on a board.Packing is done according to the Tray method.The mounting type is Surface Mount.Telecommunications equipment consists of 2 circuits.When 1V 2.5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.

VSC8572XKS-05 Features

Available in the 256-BGA package

VSC8572XKS-05 Applications

There are a lot of Microchip Technology VSC8572XKS-05 Telecom applications.

• Inverse Multiplexing for ATM (IMA)
• PDH Multiplexers
• Digital Cross-Connect Systems
• Digital access cross connects
• SDH/SONET multiplexers
• Switching Systems
• ISDN terminal adapter
• Digital cross connects (DSX-1)
• M13 MUX
• Fractional T1/E1/J1