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VSC8575XKS-11

VSC8575XKS-11

VSC8575XKS-11

Microchip Technology

Telecom device

SOT-23

VSC8575XKS-11 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-PBGA (17x17)
Packaging Tray
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $42.22000 $42.22
25 $35.17480 $879.37
100 $33.99000 $3399
VSC8575XKS-11 Product Details

VSC8575XKS-11 Overview


To save board space, the 256-BGA package is used.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted using Surface Mount.

VSC8575XKS-11 Features


Available in the 256-BGA package

VSC8575XKS-11 Applications


There are a lot of Microchip Technology VSC8575XKS-11 Telecom applications.

  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Wireless Local Loop
  • Cable PC
  • SONET/SDH terminal
  • Network Multiplexing and Terminating Equipment
  • M13 MUX
  • Cable Modem
  • Hybrid fiber coax (HFC)
  • Cable Telephony
  • SDH/SONET multiplexers

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