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VSC8582XKS-10

VSC8582XKS-10

VSC8582XKS-10

Microchip Technology

256 TerminationsTelecom device1 Functions

SOT-23

VSC8582XKS-10 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 256
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1
Supply Voltage 1V
Terminal Pitch 1mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B256
Operating Temperature (Max) 125°C
Temperature Grade AUTOMOTIVE
Data Rate 1000000 Mbps
Telecom IC Type ETHERNET TRANSCEIVER
Number of Transceivers 2
Height Seated (Max) 1.8mm
Length 17mm
Width 17mm
VSC8582XKS-10 Product Details

VSC8582XKS-10 Overview


A 256-BGA package is used to reduce board space requirements.The way of Tray is employed for telecommunications equipment packing.A Surface Mount mounting type is used.Configuration of the telecom circuit shows 256 terminations.It operates with a voltage of 1V.It adopts ETHERNET TRANSCEIVER as its telecom IC type.As part of the design process, 1 functions are configured.2 transceivers are incorporated into telecommunication tools.Telecommunication tools supports the maximum operating temperature of 125°C.

VSC8582XKS-10 Features


Available in the 256-BGA package
ETHERNET TRANSCEIVER as telecom IC type
2 transceivers

VSC8582XKS-10 Applications


There are a lot of Microchip Technology VSC8582XKS-10 Telecom applications.

  • SDH Multiplexers
  • T1/E1/J1 Multiplexer and Channel Banks
  • Central office (CO)
  • Inverse Multiplexing for ATM (IMA)
  • T1/E1/J1 Performance Monitoring
  • Digital Cross-Connect Systems
  • E2 Rates PCM Line Interface
  • Dual battery supply voltage SLICs
  • T1 Digital Cross Connects (DSX-1)
  • Cable Modem

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