VSC8582XKS-14 Overview

Space is saved on the board by using the 256-BGA package.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.1 circuits make up this telecom IC .When the voltage for 1V is provided, improved efficiency can be achieved.A temperature setting of -40°C~125°C ensures reliable performance.In telecom switching configuration, there are 256 terminations.1V is its supply voltage.

VSC8582XKS-14 Features

Available in the 256-BGA package

VSC8582XKS-14 Applications

There are a lot of Microchip Technology VSC8582XKS-14 Telecom applications.

• Digital subscriber line access multiplexer (DSLAM)
• E2 Rates PCM Line Interface
• T1/E1/J1 Multiplexer and Channel Banks
• Integrated Access Devices
• T1/E1/J1 Performance Monitoring
• ISDN terminal adapter
• T3 channelized access concentrators
• T2 Rates PCM Line Interface
• Dual battery supply voltage SLICs
• PBX (Private Branch Exchange)