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VSC8584XKS-05

VSC8584XKS-05

VSC8584XKS-05

Microchip Technology

Telecom device

SOT-23

VSC8584XKS-05 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 256-BGA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
VSC8584XKS-05 Product Details

VSC8584XKS-05 Overview


A 256-BGA package saves space on a board.A Tray-packing method is used to pack telecommunications equipment.The mounting type of this telecom circuit is Surface Mount.

VSC8584XKS-05 Features


Available in the 256-BGA package

VSC8584XKS-05 Applications


There are a lot of Microchip Technology VSC8584XKS-05 Telecom applications.

  • Interfaces to DS3
  • Fiber to the Home (FTTH)
  • Cable PC
  • CSU/DSU Equipment
  • PBX interfaces
  • Central office
  • Private branch exchange (PBX)
  • Cable modem
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Home Side Box

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