VSC8664XIC-03

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Manufacturer part number:VSC8664XIC-03

Manufacturer:Microchip Technology

Description:Telecom device1 Circuits

Case Package:SOT-23

Datasheet:VSC8664XIC-03 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	5 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type	Surface Mount
Package / Case	BGA
Supplier Device Package	256-BGA (17x17)
Packaging	Tray
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	100°C
Min Operating Temperature	-40°C
Function	Ethernet
Number of Circuits	1
Data Rate	1.25 Gbps
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

Quantity	Unit Price	Ext. Price
1	$42.129268	$42.129268
10	$39.744592	$397.44592
100	$37.494898	$3749.4898
500	$35.372545	$17686.2725
1000	$33.370326	$33370.326

VSC8664XIC-03 Overview

BGA package is used to save board space.For telecommunications equipment packing, the Tray method is used.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .During normal operation, a minimum value of -40°C is set for the temperature.100°C is set to the maximum value to ensure normal operation.