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ZL38070GBG2

ZL38070GBG2

ZL38070GBG2

Microchip Technology

535 Terminations535 Pin Telecom device1 Circuits

SOT-23

ZL38070GBG2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 535-BGA
Number of Pins 535
Operating Temperature-40°C~85°C
PackagingTray
JESD-609 Code e1
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 535
Terminal Finish TIN SILVER COPPER
Voltage - Supply 1.6V~2V
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 1.8V
Function Echo Cancellation
Number of Circuits 1
Operating Supply Current 10mA
Telecom IC Type ISDN ECHO CANCELLER
Height Seated (Max) 2.36mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:2284 items

ZL38070GBG2 Product Details

ZL38070GBG2 Overview


A 535-BGA package is used to reduce board space requirements.For telecommunications equipment packing, the Tray method is used.A Surface Mount mounting type is used.Telecommunications equipment consists of 1 circuits.1.6V~2V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.In Surface Mount's direction, telecom switching is mounted.Configuration of this telecom circuit has 535 terminations.The voltage it operates at is 1.8V.The telecom interface contains 535 pins.Telecom ICs of type ISDN ECHO CANCELLER are used in it.A designer can make use of this telecom circuit by operating with the 10mA supply current.

ZL38070GBG2 Features


Available in the 535-BGA package
ISDN ECHO CANCELLER as telecom IC type
Operating supply current of 10mA

ZL38070GBG2 Applications


There are a lot of Microchip Technology ZL38070GBG2 Telecom applications.

  • Cable PC
  • Switches
  • Fault Tolerant Systems
  • Codec function on telephone switch line cards
  • T3 channelized access concentrators
  • Stations
  • PBXs channel bank
  • Cable Modem
  • Digital Modems
  • High-Density T1/E1/J1 interfaces for Multiplexers

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