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ZL40218LDG1

ZL40218LDG1

ZL40218LDG1

Microchip Technology

1 Circuit 750MHz 1:8 Clock Buffer 32-VFQFN Exposed Pad

SOT-23

ZL40218LDG1 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 32-VFQFN Exposed Pad
Supplier Device Package 32-QFN (5x5)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fanout Buffer (Distribution)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Voltage - Supply 2.375V~3.465V
Output LVDS
Operating Supply Voltage 3.465V
Number of Circuits 1
Propagation Delay 2 ns
Frequency (Max) 750MHz
Input CML, HCSL, LVCMOS, LVDS, LVPECL
Ratio - Input:Output 1:8
Differential - Input:Output Yes/Yes
Max Duty Cycle 5 %
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
490 $4.24876 $2081.8924
ZL40218LDG1 Product Details

ZL40218LDG1 Overview


There is a case available for the cut smart buffer in 32-VFQFN Exposed Pad. The package is in the form of a Tray. In normal operation, 750MHz is the maximum value. In this case, it is set up as Surface Mount. This electronic part is classified as Fanout Buffer (Distribution). To ensure reliable performance, the temperature should be set to -40°C~85°C. This circuit clock should be able to operate on a power supply of 2.375V~3.465V volts. It is located in the way of Surface Mount. There is an output of LVDS. Temperatures below -40°C are required to keep it reliable. It is possible to achieve stable operation by setting the maximum operating temperature to 85°C. The supply voltage should be kept at 3.465V for maximum efficiency.

ZL40218LDG1 Features


The operating temperature of -40°C~85°C degrees

ZL40218LDG1 Applications


There are a lot of Microchip Technology ZL40218LDG1 Clock Buffers & Drivers applications.

  • Wireless infrastructure equipment
  • DDR4 JEDEC standard RDIMM design
  • OTN
  • High reliability telecommunication system
  • High-speed flip-flop
  • Automatic test equipment
  • Defense and aerospace equipment
  • Medical imaging
  • FPGA
  • Data center

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