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ZL50057GAC

ZL50057GAC

ZL50057GAC

Microchip Technology

272 Terminations272 Pin ZL50057 Telecom device

SOT-23

ZL50057GAC Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 272-BBGA
Number of Pins 272
Operating Temperature -40°C~85°C
Packaging Tray
Published 2007
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 272
Terminal Finish TIN LEAD
HTS Code 8542.39.00.01
Subcategory Other Telecom ICs
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1.27mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number ZL50057
Function Switch
Qualification Status Not Qualified
Power Supplies 1.83.3V
Operating Supply Current 240mA
Number of Ports 48
Height Seated (Max) 2.54mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant
ZL50057GAC Product Details

ZL50057GAC Overview


To save board space, the 272-BBGA package is used.For telecommunications equipment packing, the Tray method is used.A Surface Mount-mount is used for mounting the telecom circuit.Wtelecom IC's efficiencyh a high supply voltage, 1.71V~1.89V can be operated more efficiently.A temperature setting of -40°C~85°C ensures reliable performance.Surface Mount is mounted on telecom switching.Telecom switching configuration has 272 terminations.With 1.8V as the supply voltage, it operates.A 272 pin is included in this telecom interface.ZL50057 is the base part number, which can be used to find more related parts.Telecom product operates with the supply current of 240mA to provide much flexibility for designers.In the Other Telecom ICs subcategory, telecommunications device belongs.The telecom product has 48 ports.

ZL50057GAC Features


Available in the 272-BBGA package
Operating supply current of 240mA

ZL50057GAC Applications


There are a lot of Microchip Technology ZL50057GAC Telecom applications.

  • Multiplexers
  • Microwave transmission systems
  • Remote wireless modules
  • CSU/DSU Equipment
  • Digital subscriber line access multiplexer (DSLAM)
  • Multichannel DS1 Test Equipment
  • Interfaces to SONET STS-1 Networks
  • Hybrid fiber coax (HFC)
  • Central office (CO)
  • Cable Modem

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