MT16LSDT3264AY-13EG3

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Manufacturer part number:MT16LSDT3264AY-13EG3

Manufacturer:Micron Technology

Description:MT16LSDT3264AY-13EG3 datasheet pdf and Memory Cards product details from Micron Technology stock available on our website

Case Package:SOT-23

Datasheet:MT16LSDT3264AY-13EG3 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mount	Socket
Number of Pins	168
ECCN (US)	EAR99
Module	DRAM Module
Module Density	256Mbyte
Number of Chip per Module	16
Chip Density (bit)	128M
Data Bus Width (bit)	64
Max. Access Time (ns)	5.4
Maximum Clock Rate (MHz)	133
Chip Configuration	16Mx8
Minimum Operating Supply Voltage (V)	3
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.6
Operating Current (mA)	1336
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	65
Supplier Temperature Grade	Commercial
ECC Support	No
Number of Ranks	Dual
CAS Latency	2
Standard Package Name	DIM
Supplier Package	DIMM
Mounting	Socket
Package Height	35.05(Max)
Package Length	133.5(Max)
Package Width	3.99(Max)
PCB changed	168
Lead Shape	No Lead
RoHS	Compliant
Packaging	Tray
Part Status	Obsolete
Max Operating Temperature	65 °C
Min Operating Temperature	0 °C
Pin Count	168
Operating Supply Voltage	3.3 V
Number of Elements	16
Max Supply Voltage	3.6 V
Min Supply Voltage	3 V
Access Time	5.4 ns
Data Bus Width	64 b
Organization	32Mx64
Max Frequency	133 MHz
Module Type	168UDIMM
RoHS Status	Yes with exemptions
Radiation Hardening	No