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MT29F64G08CBAAAL74A3WC1P

MT29F64G08CBAAAL74A3WC1P

MT29F64G08CBAAAL74A3WC1P

Micron Technology Inc.

Memory IC

SOT-23

MT29F64G08CBAAAL74A3WC1P Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 2 Weeks
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2013
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Technology FLASH - NAND
Voltage - Supply 2.7V~3.6V
Interface Parallel
Memory Size 64Gb 8G x 8
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $11.73000 $11.73
MT29F64G08CBAAAL74A3WC1P Product Details

MT29F64G08CBAAAL74A3WC1P Overview


A Non-Volatile-type memory can be classified as the memory type of this device. Case Tray is available. An embedded Die case surrounds memory ics. A memory chip with a capacity of 64Gb 8G x 8 is used on this device. As with most mainstream devices, this one uses FLASH-format memory. This device has an extended operating temperature range of 0°C~70°C TA, so it's perfect for a wide range of demanding applications. It is supplied votage within 2.7V~3.6V. A Surface Mount mounting type is recommended for this product. Memory ics must operate at a temperature of at least 0°C. Temperatures no higher than 70°C degrees Celsius are recommended for operation.

MT29F64G08CBAAAL74A3WC1P Features


Package / Case: Die

MT29F64G08CBAAAL74A3WC1P Applications


There are a lot of Micron Technology Inc. MT29F64G08CBAAAL74A3WC1P Memory applications.

  • eDRAM
  • multimedia computers
  • eSRAM
  • personal computers
  • DVD disk buffer
  • supercomputers
  • embedded logic
  • networking
  • networks
  • Cache memory

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