MT9VDDT6472HG-335F2

new-10%

Manufacturer part number:MT9VDDT6472HG-335F2

Manufacturer:Micron Technology Inc.

Description:MODULE DDR SDRAM 512MB 200SODIMM

Case Package:SOT-23

Datasheet:MT9VDDT6472HG-335F2 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mount	Socket
Package / Case	200-SODIMM
Number of Pins	200
Packaging	Bulk
Published	2002
JESD-609 Code	e0
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	200
Terminal Finish	TIN LEAD
Max Operating Temperature	70°C
Min Operating Temperature	0°C
Additional Feature	AUTO/SELF REFRESH
HTS Code	8542.32.00.36
Subcategory	Other Memory ICs
Technology	CMOS
Terminal Position	DUAL
Peak Reflow Temperature (Cel)	235
Number of Functions	1
Supply Voltage	2.5V
Terminal Pitch	0.6mm
[email protected] Reflow Temperature-Max (s)	30
Pin Count	200
Operating Supply Voltage	2.5V
Number of Elements	9
Temperature Grade	COMMERCIAL
Max Supply Voltage	2.7V
Min Supply Voltage	2.3V
Memory Size	512MB
Number of Ports	1
Speed	333MT/s
Memory Type	DDR SDRAM
Clock Frequency	166MHz
Supply Current-Max	3.645mA
Data Bus Width	72b
Organization	64MX72
Output Characteristics	3-STATE
Memory Width	72
Standby Current-Max	0.045A
Memory Density	4831838208 bit
Max Frequency	333MHz
Access Time (Max)	0.7 ns
I/O Type	COMMON
Access Mode	SINGLE BANK PAGE BURST
Height	31.8mm
Radiation Hardening	No
RoHS Status	Non-RoHS Compliant
Lead Free	Contains Lead