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NAND256W3A0BZA6E

NAND256W3A0BZA6E

NAND256W3A0BZA6E

Micron Technology Inc.

3/3.3V V Surface Mount 55 Pin Memory IC NAND256-A 256 Mb kb 10mm mm 20mA mA 8b b

SOT-23

NAND256W3A0BZA6E Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 55-TFBGA
Number of Pins 55
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2013
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 55
ECCN Code 3A991.B.1.A
Terminal Finish TIN SILVER COPPER
HTS Code 8542.32.00.51
Technology FLASH - NAND
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.8mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number NAND256-A
Pin Count 55
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Nominal Supply Current 20mA
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Organization 32MX8
Memory Width 8
Write Cycle Time - Word, Page 50ns
Address Bus Width 25b
Density 256 Mb
Standby Current-Max 0.00005A
Access Time (Max) 35 ns
Sync/Async Asynchronous
Word Size 8b
Programming Voltage 3V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 2K
Sector Size 16K
Page Size 512words
Ready/Busy YES
Height Seated (Max) 1.05mm
Length 10mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,518 $3.00243 $3.00243
NAND256W3A0BZA6E Product Details

NAND256W3A0BZA6E Overview


There is a Non-Volatile memory type associated with this device. Tray-cases are available. The file is embedded in a 55-TFBGA case. It is estimated that the memory size on the chip is 256Mb 32M x 8. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. The device is capable of handling a supply voltage of 2.7V~3.6V volts. Its recommended mounting type is Surface Mount. The chip has 55 terminations. In total, 1 functions are supported by this part. In order to power this memory device, 3V will be necessary. To select similar parts, many people use the device's base part number NAND256-A. A 55-pin package containing this memory device is used to house this device. I have noticed that the memory device has 55 pins, which indicates that it has 55 locations in the memory. In this chip, Surface Mount mounting is used, a straightforward, high-efficiency mounting method. It is rated for a nominal supply current of 20mA for this memory component. This memory chip requires a mere 3/3.3V of power. A programming voltage of 3V is required to alter the state of certain nonvolatile memory arrays. It is important to keep in mind that this memory has 2K specific sized divisions in total.

NAND256W3A0BZA6E Features


Package / Case: 55-TFBGA
55 Pins

NAND256W3A0BZA6E Applications


There are a lot of Micron Technology Inc. NAND256W3A0BZA6E Memory applications.

  • graphics card
  • printers
  • telecommunications
  • personal digital assistants
  • mainframes
  • Cache memory
  • data buffer
  • supercomputers
  • workstations,
  • networking

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