3/3.3V V Surface Mount 55 Pin Memory IC NAND256-A 256 Mb kb 10mm mm 20mA mA 8b b
SOT-23
NAND256W3A0BZA6E Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
55-TFBGA
Number of Pins
55
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2013
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
55
ECCN Code
3A991.B.1.A
Terminal Finish
TIN SILVER COPPER
HTS Code
8542.32.00.51
Technology
FLASH - NAND
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
0.8mm
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
NAND256-A
Pin Count
55
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 32M x 8
Nominal Supply Current
20mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Organization
32MX8
Memory Width
8
Write Cycle Time - Word, Page
50ns
Address Bus Width
25b
Density
256 Mb
Standby Current-Max
0.00005A
Access Time (Max)
35 ns
Sync/Async
Asynchronous
Word Size
8b
Programming Voltage
3V
Data Polling
NO
Toggle Bit
NO
Command User Interface
YES
Number of Sectors/Size
2K
Sector Size
16K
Page Size
512words
Ready/Busy
YES
Height Seated (Max)
1.05mm
Length
10mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,518
$3.00243
$3.00243
NAND256W3A0BZA6E Product Details
NAND256W3A0BZA6E Overview
There is a Non-Volatile memory type associated with this device. Tray-cases are available. The file is embedded in a 55-TFBGA case. It is estimated that the memory size on the chip is 256Mb 32M x 8. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. The device is capable of handling a supply voltage of 2.7V~3.6V volts. Its recommended mounting type is Surface Mount. The chip has 55 terminations. In total, 1 functions are supported by this part. In order to power this memory device, 3V will be necessary. To select similar parts, many people use the device's base part number NAND256-A. A 55-pin package containing this memory device is used to house this device. I have noticed that the memory device has 55 pins, which indicates that it has 55 locations in the memory. In this chip, Surface Mount mounting is used, a straightforward, high-efficiency mounting method. It is rated for a nominal supply current of 20mA for this memory component. This memory chip requires a mere 3/3.3V of power. A programming voltage of 3V is required to alter the state of certain nonvolatile memory arrays. It is important to keep in mind that this memory has 2K specific sized divisions in total.
NAND256W3A0BZA6E Features
Package / Case: 55-TFBGA 55 Pins
NAND256W3A0BZA6E Applications
There are a lot of Micron Technology Inc. NAND256W3A0BZA6E Memory applications.