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TE28F160B3TD70A

TE28F160B3TD70A

TE28F160B3TD70A

Micron Technology Inc.

Memory IC 28F160B3

SOT-23

TE28F160B3TD70A Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Supplier Device Package 48-TSOP
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2002
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2 (1 Year)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Technology FLASH - Boot Block
Voltage - Supply 2.7V~3.6V
Base Part Number 28F160B3
Interface Parallel
Memory Size 16Mb 1M x 16
Memory Type Non-Volatile
Access Time 70ns
Memory Format FLASH
Memory Interface Parallel
Write Cycle Time - Word, Page 70ns
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
576 $1.84229 $1061.15904
TE28F160B3TD70A Product Details

TE28F160B3TD70A Overview


There is a Non-Volatile memory type associated with this device. It comes in a Tray. The case is embedded in 48-TFSOP (0.724, 18.40mm Width). The memory size of the chip is 16Mb 1M x 16 Mb. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. -40°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. It is supplied votage within 2.7V~3.6V. There is a recommended mounting type of Surface Mount for it. It is common to select similar parts by referring to the device's base part number, 28F160B3. A minimum operating temperature of -40°C is required for this device. It is recommended for operation at temperatures no higher than.

TE28F160B3TD70A Features


Package / Case: 48-TFSOP (0.724, 18.40mm Width)

TE28F160B3TD70A Applications


There are a lot of Micron Technology Inc. TE28F160B3TD70A Memory applications.

  • workstations,
  • Cache memory
  • telecommunications
  • eSRAM
  • data buffer
  • networks
  • hard disk drive (HDD)
  • Camcorders
  • networking
  • supercomputers

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