1N5809US

new-10%

Manufacturer part number:1N5809US

Manufacturer:Microsemi Corporation

Description:Diode Switching 100V 6A 2-Pin E-MELF

Case Package:SOT-23

Datasheet:1N5809US Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	7 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	SQ-MELF, B
Number of Pins	2
Diode Element Material	SILICON
Packaging	Bulk
Published	1997
JESD-609 Code	e0
Pbfree Code	no
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
ECCN Code	EAR99
Terminal Finish	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Max Operating Temperature	175°C
Min Operating Temperature	-65°C
Additional Feature	HIGH RELIABILITY, METALLURGICALLY BONDED
HTS Code	8541.10.00.80
Terminal Position	END
Terminal Form	WRAP AROUND
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Reach Compliance Code	not_compliant
[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
Pin Count	2
Number of Elements	1
Element Configuration	Single
Speed	Fast Recovery =< 500ns, > 200mA (Io)
Diode Type	Standard
Current - Reverse Leakage @ Vr	5μA @ 100V
Voltage - Forward (Vf) (Max) @ If	875mV @ 4A
Case Connection	ISOLATED
Forward Current	6A
Operating Temperature - Junction	-65°C~175°C
Output Current-Max	3A
Application	ULTRA FAST RECOVERY
Forward Voltage	875mV
Max Reverse Voltage (DC)	100V
Average Rectified Current	3A
Number of Phases	1
Reverse Recovery Time	30 ns
Peak Reverse Current	5μA
Max Repetitive Reverse Voltage (Vrrm)	100V
Capacitance @ Vr, F	60pF @ 10V 1MHz
Peak Non-Repetitive Surge Current	125A
Radiation Hardening	Yes
RoHS Status	Non-RoHS Compliant
Lead Free	Contains Lead