1N6073US

new-10%

Manufacturer part number:1N6073US

Manufacturer:Microsemi Corporation

Description:DIODE GEN PURP 50V 3A D5A

Case Package:SOT-23

Datasheet:1N6073US Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	17 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 2 weeks ago)
Contact Plating	Lead, Tin
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	SQ-MELF, A
Number of Pins	2
Diode Element Material	SILICON
Packaging	Bulk
Published	1997
JESD-609 Code	e0
Pbfree Code	no
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
ECCN Code	EAR99
Terminal Finish	TIN LEAD
Max Operating Temperature	155°C
Min Operating Temperature	-65°C
Additional Feature	HIGH RELIABILITY
HTS Code	8541.10.00.80
Technology	AVALANCHE
Terminal Position	END
Terminal Form	WRAP AROUND
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Tim[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
Pin Count	2
Qualification Status	Not Qualified
Number of Elements	1
Element Configuration	Single
Speed	Fast Recovery =< 500ns, > 200mA (Io)
Diode Type	Standard
Current - Reverse Leakage @ Vr	1μA @ 50V
Voltage - Forward (Vf) (Max) @ If	2.04V @ 9.4A
Case Connection	ISOLATED
Forward Current	3A
Operating Temperature - Junction	-65°C~155°C
Output Current-Max	0.85A
Max Reverse Voltage (DC)	50V
Average Rectified Current	3A
Reverse Recovery Time	30 ns
Max Repetitive Reverse Voltage (Vrrm)	50V
RoHS Status	Non-RoHS Compliant