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A2F060M3E-1FGG256I

A2F060M3E-1FGG256I

A2F060M3E-1FGG256I

Microsemi Corporation

256 Terminations -40°C~100°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O 1.5V

SOT-23

A2F060M3E-1FGG256I Datasheet

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Specifications
Name Value
Type Parameter
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F060M3E
Number of Outputs 66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 26, FPGA - 66
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 1536 CLBS, 60000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Equivalent Gates 60000
Flash Size 128KB
Length 17mm
Height Seated (Max) 1.7mm
Width 17mm
RoHS Status RoHS Compliant
A2F060M3E-1FGG256I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 16KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion® is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of MCU - 26, FPGA - 66 I/Os in total.A power supply with a 1.5V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 256 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 66 outputs.This flash has a size of 128KB.A2F060M3E can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 256 pins.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-1FGG256I System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare

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