256 Terminations -40°C~100°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O 1.5V
SOT-23
A2F060M3E-1FGG256I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
256-LBGA
Surface Mount
YES
Number of Pins
256
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®
Published
2015
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.5V
Terminal Pitch
1mm
Frequency
100MHz
Time@Peak Reflow Temperature-Max (s)
30
Base Part Number
A2F060M3E
Number of Outputs
66
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.575V
Supply Voltage-Min (Vsup)
1.425V
Interface
EBI/EMI, I2C, SPI, UART, USART
Number of I/O
MCU - 26, FPGA - 66
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Organization
1536 CLBS, 60000 GATES
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Number of Logic Blocks (LABs)
8
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Equivalent Gates
60000
Flash Size
128KB
Length
17mm
Height Seated (Max)
1.7mm
Width
17mm
RoHS Status
RoHS Compliant
A2F060M3E-1FGG256I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 16KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion® is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of MCU - 26, FPGA - 66 I/Os in total.A power supply with a 1.5V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 256 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 66 outputs.This flash has a size of 128KB.A2F060M3E can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 256 pins.
ARM® Cortex®-M3 processor.
16KB RAM. Built on MCU, FPGA. 128KB extended flash. Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-1FGG256I System On Chip (SoC) applications.