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A2F060M3E-1TQ144

A2F060M3E-1TQ144

A2F060M3E-1TQ144

Microsemi Corporation

0°C~85°C TJ A2F060M3E System On Chip SmartFusion® Series MCU - 21, FPGA - 33 I/O

SOT-23

A2F060M3E-1TQ144 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 100MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 21, FPGA - 33
Speed 100MHz
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS Status Non-RoHS Compliant
A2F060M3E-1TQ144 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 144-LQFP.With 16KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion® is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 21, FPGA - 33 I/Os are available in this SoC part.The flash size of the SoC meaning is 128KB.A search for A2F060M3E will result in system on chips that have similar specs and purposes.A frequency of 100MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.Just 0°C is needed to get the SoC computing up and running.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 85°C.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-1TQ144 System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness

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