This SoC is built on ARM® Cortex®-M3 core processor(s).

Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.With 16KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion® is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 26, FPGA - 66 inputs and outputs.This flash has a size of 128KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F060M3E.During operation, the wireless SoC runs at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 256.In order for the SoC computing to start, -40°C is just about right.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.Voltages up to 1.575V are specified for this SoC security.Power is provided to it at least to the extent that 1.425V is required.

ARM® Cortex®-M3 processor.

16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

A2F060M3E-FG256I System On Chip (SoC) applications.

• Networked sensors
• Robotics
• Central alarm system
• Smart appliances
• Industrial automation devices
• Sports
• Fitness
• Healthcare
• Medical
• Remote control