This SoC is built on ARM® Cortex®-M3 core processor(s).

Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 256-LBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 26, FPGA - 66 I/Os are included in this SoC part.A 128KB flash can be seen on it.Search A2F060M3E for system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.Core architecture of ARM underpins the SoC meaning.There is a 256-pin version of this computer SoC available.For the SoC computing to start, -40°C is sufficient.This SoC system on chip operates at a maximum design temperature of 100°C.Supply voltage is rated at 1.575V.A minimum of 1.425V power is supplied to it.

ARM® Cortex®-M3 processor.

16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

A2F060M3E-FGG256I System On Chip (SoC) applications.

• Body control module
• Industrial transport
• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics