256 Terminations 0°C~85°C TJ 256 Pin A2F200 System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V Min 1.425V V Max 1.575V V
SOT-23
A2F200M3F-FG256 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®
Published
2012
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Terminal Finish
TIN LEAD/TIN LEAD SILVER
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.5V
Terminal Pitch
1mm
Frequency
80MHz
Time@Peak Reflow Temperature-Max (s)
30
Base Part Number
A2F200
Number of Outputs
66
Qualification Status
Not Qualified
Operating Supply Voltage
1.5V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Operating Supply Current
2mA
Number of I/O
MCU - 25, FPGA - 66
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Number of Gates
200000
Number of Logic Blocks (LABs)
8
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size
256KB
Length
17mm
Height Seated (Max)
1.7mm
Width
17mm
RoHS Status
Non-RoHS Compliant
A2F200M3F-FG256 Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion® is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 25, FPGA - 66 inputs and outputs.Ideally, a power supply with a voltage of 1.5V should be used.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 66 outputs, which is convenient.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.During operation, the wireless SoC runs at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 256.Voltages up to 1.575V are specified for this SoC security.Power is provided to it at least to the extent that 1.425V is required.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash. Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-FG256 System On Chip (SoC) applications.