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A2F200M3F-FG256

A2F200M3F-FG256

A2F200M3F-FG256

Microsemi Corporation

256 Terminations 0°C~85°C TJ 256 Pin A2F200 System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V Min 1.425V V Max 1.575V V

SOT-23

A2F200M3F-FG256 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN LEAD/TIN LEAD SILVER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F200
Number of Outputs 66
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Operating Supply Current 2mA
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 200000
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Length 17mm
Height Seated (Max) 1.7mm
Width 17mm
RoHS Status Non-RoHS Compliant
A2F200M3F-FG256 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion® is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 25, FPGA - 66 inputs and outputs.Ideally, a power supply with a voltage of 1.5V should be used.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 66 outputs, which is convenient.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.During operation, the wireless SoC runs at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 256.Voltages up to 1.575V are specified for this SoC security.Power is provided to it at least to the extent that 1.425V is required.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F200M3F-FG256 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

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