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A2F200M3F-FGG256

A2F200M3F-FGG256

A2F200M3F-FGG256

Microsemi Corporation

0°C~85°C TJ 256 Pin A2F200 System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O Min 1.425V V Max 1.575V V

SOT-23

A2F200M3F-FGG256 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2011
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 80MHz
Base Part Number A2F200
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 7mA
Number of I/O MCU - 25, FPGA - 66
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 2500
Core Architecture ARM
Number of Gates 200000
Max Frequency 100MHz
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Registers 4608
Flash Size 256KB
Radiation Hardening No
RoHS Status RoHS Compliant
A2F200M3F-FGG256 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion® is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 25, FPGA - 66 inputs and outputs.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.During operation, the wireless SoC runs at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 256.In order for the SoC computing to start, 0°C is just about right.There is a maximum operating temperature of 85°C set for this SoC system on chip during its design.Voltages up to 1.575V are specified for this SoC security.Power is provided to it at least to the extent that 1.425V is required.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F200M3F-FGG256 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

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