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A2F200M3F-FGG256I

A2F200M3F-FGG256I

A2F200M3F-FGG256I

Microsemi Corporation

-40°C~100°C TJ 256 Pin A2F200 System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O Min 1.425V V Max 1.575V V

SOT-23

A2F200M3F-FGG256I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 1997
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 80MHz
Base Part Number A2F200
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 7mA
Number of I/O MCU - 25, FPGA - 66
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 2500
Core Architecture ARM
Number of Gates 200000
Max Frequency 100MHz
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $45.19000 $45.19
90 $39.81200 $3583.08
180 $37.66000 $6778.8
270 $35.50800 $9587.16
A2F200M3F-FGG256I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion® series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of MCU - 25, FPGA - 66 I/Os.The flash is set to 256KB.By searching A2F200, you can find system on chips with similar specs and purposes.There is 80MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.256 pins are present on this computer SoC.It is just enough to start the SoC computing at -40°C.As designed, this SoC system on chip can operate at a maximum temperature of 100°C.Voltage of maximum supply is 1.575V.The SoC security is powered at least by 1.425V.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F200M3F-FGG256I System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system

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