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A2F200M3F-PQ208I

A2F200M3F-PQ208I

A2F200M3F-PQ208I

Microsemi Corporation

208 Terminations -40°C~100°C TJ 208 Pin A2F200 System On Chip SmartFusion® Series MCU - 22, FPGA - 66 I/O 1.5V

SOT-23

A2F200M3F-PQ208I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 208-BFQFP
Surface Mount YES
Number of Pins 208
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F200
Number of Outputs 66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 22, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Equivalent Gates 200000
Flash Size 256KB
Height Seated (Max) 4.1mm
RoHS Status Non-RoHS Compliant
A2F200M3F-PQ208I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 208-BFQFP.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion® is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 22, FPGA - 66 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.The SoCs wireless cannot operate at a voltage greater than 1.575V because it is considered unsafe for the application.If it has at least a 1.425V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 208 terminations, so system on a chip is really aided by this.There is the option to have 66 outputs on this SoC chip.The flash size of the SoC meaning is 256KB.A search for A2F200 will result in system on chips that have similar specs and purposes.A frequency of 80MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is available in 208-pin form.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F200M3F-PQ208I System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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