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A2F200M3F-PQG208I

A2F200M3F-PQG208I

A2F200M3F-PQG208I

Microsemi Corporation

208 Terminations -40°C~100°C TJ 208 Pin A2F200 System On Chip SmartFusion® Series MCU - 22, FPGA - 66 I/O 1.5V Min 1.425V V Max 1.575V V

SOT-23

A2F200M3F-PQG208I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 208-BFQFP
Surface Mount YES
Number of Pins 208
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2007
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Finish Pure Matte Tin (Sn)
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F200
Number of Outputs 66
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Number of I/O MCU - 22, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Equivalent Gates 200000
Flash Size 256KB
Height Seated (Max) 4.1mm
RoHS Status RoHS Compliant
A2F200M3F-PQG208I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 208-BFQFP package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion® series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of MCU - 22, FPGA - 66 I/Os.For safe operation, it is advisable to utilize a power supply with 1.5V voltage.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 208 terminations in total.In order for this SoC chip to work properly, you can have 66 outputs.As for its flash size, it is 256KB.By searching A2F200, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 208 pins.It has a maximum supply voltage of 1.575V rated for it.As long as it receives at least 1.425V of power, then it is working.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F200M3F-PQG208I System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

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