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A2F500M3G-1FGG256M

A2F500M3G-1FGG256M

A2F500M3G-1FGG256M

Microsemi Corporation

-55°C~125°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O

SOT-23

A2F500M3G-1FGG256M Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Frequency 100MHz
Base Part Number A2F500M3G
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $611.48156 $55033.3404
A2F500M3G-1FGG256M Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 256-LBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of -55°C~125°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 25, FPGA - 66 I/Os are included in this SoC part.A 512KB flash can be seen on it.Search A2F500M3G for system on chips with similar specs and purposes.wireless SoCs operate at 100MHz.Core architecture of ARM underpins the SoC meaning.There is a 256-pin version of this computer SoC available.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-1FGG256M System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

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