-55°C~125°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O
SOT-23
A2F500M3G-1FGG256M Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
-55°C~125°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTS Code
8542.39.00.01
Frequency
100MHz
Base Part Number
A2F500M3G
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 25, FPGA - 66
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size
512KB
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
90
$611.48156
$55033.3404
A2F500M3G-1FGG256M Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 256-LBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of -55°C~125°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 25, FPGA - 66 I/Os are included in this SoC part.A 512KB flash can be seen on it.Search A2F500M3G for system on chips with similar specs and purposes.wireless SoCs operate at 100MHz.Core architecture of ARM underpins the SoC meaning.There is a 256-pin version of this computer SoC available.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. Core Architecture: ARM
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A2F500M3G-1FGG256M System On Chip (SoC) applications.