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A2F500M3G-1FGG484

A2F500M3G-1FGG484

A2F500M3G-1FGG484

Microsemi Corporation

0°C~85°C TJ 484 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 41, FPGA - 128 I/O Min 1.425V V Max 1.575V V

SOT-23

A2F500M3G-1FGG484 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 484-BGA
Number of Pins 484
Supplier Device Package 484-FPBGA (23x23)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2011
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 100MHz
Base Part Number A2F500M3G
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 13.5kB
Operating Supply Current 16.5mA
Number of I/O MCU - 41, FPGA - 128
Speed 100MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 5500
Core Architecture ARM
Number of Gates 500000
Max Frequency 120MHz
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Registers 11520
Flash Size 512KB
Radiation Hardening No
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $71.38000 $71.38
60 $64.02483 $3841.4898
120 $60.56400 $7267.68
A2F500M3G-1FGG484 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 41, FPGA - 128 I/Os are included in this SoC part.A 512KB flash can be seen on it.Search A2F500M3G for system on chips with similar specs and purposes.wireless SoCs operate at 100MHz.Core architecture of ARM underpins the SoC meaning.There is a 484-pin version of this computer SoC available.For the SoC computing to start, 0°C is sufficient.This SoC system on chip operates at a maximum design temperature of 85°C.Supply voltage is rated at 1.575V.A minimum of 1.425V power is supplied to it.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-1FGG484 System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

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