-55°C~125°C TJ A2F500M3G System On Chip SmartFusion® Series MCU - 41, FPGA - 128 I/O
SOT-23
A2F500M3G-1FGG484M Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Package / Case
484-BGA
Operating Temperature
-55°C~125°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTS Code
8542.39.00.01
Frequency
100MHz
Base Part Number
A2F500M3G
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 41, FPGA - 128
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size
512KB
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
60
$627.45000
$37647
A2F500M3G-1FGG484M Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 484-BGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion® series.For this SoC meaning, the average operating temperature should be -55°C~125°C TJ.A key point to note is that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 41, FPGA - 128.There is a flash of 512KB.Searching A2F500M3G will yield system on chips with similar specs and purposes.100MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. Core Architecture: ARM
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A2F500M3G-1FGG484M System On Chip (SoC) applications.