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A2F500M3G-1PQG208

A2F500M3G-1PQG208

A2F500M3G-1PQG208

Microsemi Corporation

208 Terminations 0°C~85°C TJ 208 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 22, FPGA - 66 I/O 1.5V Min 1.425V V Max 1.575V V

SOT-23

A2F500M3G-1PQG208 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 208-BFQFP
Surface Mount YES
Number of Pins 208
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Finish Pure Matte Tin (Sn)
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F500M3G
Operating Supply Voltage 1.5V
Interface Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Number of I/O MCU - 22, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 11520 CLBS, 500000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Length 28mm
Height Seated (Max) 4.1mm
Width 28mm
RoHS Status RoHS Compliant
A2F500M3G-1PQG208 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 208-BFQFP to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 22, FPGA - 66 I/Os.Use a power supply with a voltage of 1.5V if possible.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 208 terminations.A flashing 512KB appears on it.Searching A2F500M3G will bring up system on chips with similar specs and purposes.At 100MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 208-pin version.There is a maximum supply voltage of 1.575V.A minimum of 1.425V are supplied to it.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-1PQG208 System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances

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