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A2F500M3G-FG256I

A2F500M3G-FG256I

A2F500M3G-FG256I

Microsemi Corporation

256 Terminations -40°C~100°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V

SOT-23

A2F500M3G-FG256I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F500M3G
Number of Outputs 66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 2mA
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 500000
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
Length 17mm
Height Seated (Max) 1.7mm
Width 17mm
RoHS Status Non-RoHS Compliant
A2F500M3G-FG256I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 256-LBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.Use a power supply with a voltage of 1.5V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.575V.Power supplies of at least 1.425V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 256 terminations.A SoC chip like this can have 66 outputs.In order to operate system on chip, you will need 1.51.82.53.3V power supplies.A flashing 512KB appears on it.Searching A2F500M3G will bring up system on chips with similar specs and purposes.At 80MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 256-pin version.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-FG256I System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances

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