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A2F500M3G-FGG256M

A2F500M3G-FGG256M

A2F500M3G-FGG256M

Microsemi Corporation

-55°C~125°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O

SOT-23

A2F500M3G-FGG256M Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Frequency 80MHz
Base Part Number A2F500M3G
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
RoHS Status RoHS Compliant
A2F500M3G-FGG256M Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion® is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -55°C~125°C TJ when it is operating normally.A significant feature of this SoC security is the combination of ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 25, FPGA - 66 inputs and outputs.This flash has a size of 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F500M3G.During operation, the wireless SoC runs at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 256.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-FGG256M System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

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