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A2F500M3G-PQ208I

A2F500M3G-PQ208I

A2F500M3G-PQ208I

Microsemi Corporation

208 Terminations -40°C~100°C TJ 208 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 22, FPGA - 66 I/O 1.5V

SOT-23

A2F500M3G-PQ208I Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 208-BFQFP
Surface Mount YES
Number of Pins 208
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2013
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F500M3G
Number of Outputs 66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 22, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 11520 CLBS, 500000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Length 28mm
Height Seated (Max) 4.1mm
Width 28mm
RoHS Status Non-RoHS Compliant
A2F500M3G-PQ208I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 208-BFQFP package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion® series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of MCU - 22, FPGA - 66 I/Os.For safe operation, it is advisable to utilize a power supply with 1.5V voltage.In the SoCs wireless, high voltages above 1.575V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.425V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 208 terminations in total.In order for this SoC chip to work properly, you can have 66 outputs.This system on chip SoC requires 1.51.82.53.3V power supply at all.As for its flash size, it is 512KB.By searching A2F500M3G, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 208 pins.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-PQ208I System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

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