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A2P250-QNG132T

A2P250-QNG132T

A2P250-QNG132T

Microsemi Corporation

FPGAs 132-WFQFN

SOT-23

A2P250-QNG132T Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 132-WFQFN
Supplier Device Package 132-QFN (8x8)
Packaging Tray
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number A2P250
RoHS Status RoHS Compliant
A2P250-QNG132T Product Details

A2P250-QNG132T Overview


There are two packages that contain fpga chips: 132-WFQFN package and X package. Surface Mount-connectors can be used to attach this FPGA module to the development board. Using the Tray layout, this FPGA model can be contained in a very small amount of space. If you are looking for related parts, you can use the base part number A2P250 as a starting point. The device package supplied by 132-QFN (8x8) is one of its suppliers.

A2P250-QNG132T Features



A2P250-QNG132T Applications


There are a lot of Microsemi Corporation A2P250-QNG132T FPGAs applications.

  • Aerospace and Defense
  • Secure Communication
  • Audio
  • Software-defined radio
  • Defense Applications
  • Automotive Applications
  • Medical ultrasounds
  • Military Temperature
  • Radar and Sensors
  • Image processing

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