A3P1000-2FG256M Overview

There are two packages that contain fpga chips: 256-LBGA package and X package. Its 177 I/Os help it transfer data more efficiently. This FPGA module can be attached to the development board with a Surface Mount. In order to operate it, it requires a voltage supply of 1.14V~1.575V . As part of the ProASIC3 series of FPGAs, it is a type of FPGA. Operating temperatures should be maintained within the -55°C~125°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 147456 bFpga chipss. This FPGA module has a RAM si4kBe of 4kB that is sufficient to make sure that the program is able to run normally. In order to make it work, 256 pins have been designed. As far as the maximum operating temperature of this module is concerned, it reaches 125°C. Operating temperatures should exceed -55°C. There are 1000000 gates in its basic building block. During the process of storing and transferring data, 24576 registers are used. Its supplier package is called 256-FPBGA (17x17).

A3P1000-2FG256M Features

177 I/Os
Up to 147456 RAM bits
256 LABs/CLBs
125°C gates
24576 registers

A3P1000-2FG256M Applications

There are a lot of Microsemi Corporation A3P1000-2FG256M FPGAs applications.

• Development Boards and Shields for Microcontrollers
• Data Mining
• Image processing
• Consumer Electronics
• Distributed Monetary Systems
• Solar Energy
• Digital signal processing
• Audio
• Wired Communications
• Automotive Applications