A3P1000-FGG256M Overview

There is a 256-LBGA package that includes this component. Fpga chips is programmed wFpga chipsh 177 I/Os for transferring data in a more coherent manner. The Surface Mount-slot on the development board allows you to attach the FPGA module. This device is powered by a 1.14V~1.575V battery. It is a type of FPGA belonging to the ProASIC3 seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -55°C~125°C TJ while the machine is operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that this device offer is 147456. The FPGA module's RAM si4kBe reaches 4kB in order to ensure that the program operates in a normal manner. It has a total of 256 pins that are designed for it. During its maximal operating temperature, this module reaches 125°C. The operating temperature should be higher than -55°C. The basic building block of this system consists of 1000000 gates. The structure of the registers used to store and transfer data consists of 24576 registers. The device package supplied by 256-FBGA (17x17) is one of its suppliers.

A3P1000-FGG256M Features

177 I/Os
Up to 147456 RAM bits
256 LABs/CLBs
125°C gates
24576 registers

A3P1000-FGG256M Applications

There are a lot of Microsemi Corporation A3P1000-FGG256M FPGAs applications.

• Data Center
• Medical Electronics
• Telecommunication
• Medical imaging
• Automotive
• Artificial intelligence (AI)
• Industrial,Medical and Scientific Instruments
• Industrial Ethernet
• ADAS
• Military DSP