A3P250-PQG208I Overview

As part of the 208-BFQFP package, it is included. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 151 I/Os help it transfer data more efficiently. There are 3000 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.5V. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.425V~1.575V , at which it runs. FPGAs belonging to the ProASIC3 series are a type of FPGA that belong to the ProASIC3 series of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. There are a total of 208 terminations. There are 36864 RAM bits that are available with this device. A3P250 is the base part number that can be used to identify related parts. There is a maximum RAM si4.5kBe of 4.5kB on this FPGA module, which is necessary to ensure the normal operation of the program. In this case, 208 pins are used in the design. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. With a 1.5V supply voltage, designers can fully utilize the flexibility of the device. Fpga semiconductor is made up of 250000 gates as fpga semiconductors basic building block. Data and programs can be stored in this FPGA module's memory of 4.5kB. The data is stored and transferred using 6144 registers that are used for this purpose. In order to deliver high efficiency, fpga semiconductor operates at a frequency of 231MHz. During operation, it uses 30mA of supply current.

A3P250-PQG208I Features

151 I/Os
Up to 36864 RAM bits
208 LABs/CLBs
6144 registers
Operating from a frequency of 231MHz

A3P250-PQG208I Applications

There are a lot of Microsemi Corporation A3P250-PQG208I FPGAs applications.

• Wireless Communications
• Solar Energy
• Medical Electronics
• Filtering and communication encoding
• Data center hardware accelerators
• Telecommunication
• Distributed Monetary Systems
• Camera time adjustments
• Automotive advanced driver assistance systems (ADAS)
• Artificial intelligence (AI)