1.8mm mm FPGAs ProASIC3 Series 256-LBGA 1mm mm 256
SOT-23
A3P600-2FGG256I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
256-LBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
ProASIC3
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Technology
CMOS
Voltage - Supply
1.425V~1.575V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.5V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Base Part Number
A3P600
JESD-30 Code
S-PBGA-B256
Qualification Status
Not Qualified
Number of I/O
177
Clock Frequency
350MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits
110592
Number of Gates
600000
Number of CLBs
13824
Height Seated (Max)
1.8mm
Length
17mm
Width
17mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
90
$55.20000
$4968
A3P600-2FGG256I Product Details
A3P600-2FGG256I Overview
This package is included in the 256-LBGA package and is available for purchase. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. Fpga chips is programmed wFpga chipsh 177 I/Os for transferring data in a more coherent manner. Supply voltage is 1.5V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. FPGAs belonging to the ProASIC3 series are a type of FPGA that belong to the ProASIC3 series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. It is for space saving reasons that this FPGA model is contained in Tray. Total terminations are 256. As far as the RAM bits are concerned, this device offers you a total of 110592. A3P600 is the base part number that can be used to identify related parts. Its basic building block contains 600000 gates. A crystal oscillating at 350MHz is one of the most common components of this device. There are 13824 CLBs that make up the architecture of the system.
A3P600-2FGG256I Features
177 I/Os Up to 110592 RAM bits
A3P600-2FGG256I Applications
There are a lot of Microsemi Corporation A3P600-2FGG256I FPGAs applications.
Software-defined radios
Security systems
Military Temperature
Consumer Electronics
Development Boards and Shields for Microcontrollers