A3P600L-1PQ208 Overview

This package is included in the 208-BFQFP package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. The Surface Mount-slot connector on the FPGA module can be connected to the development board. With a supply voltage of 1.14V~1.575V, this device operates with ease. It is a type of FPGA that belongs to the ProASIC3L series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Having a RAM bit size of 110592 means that this device will offer you a lot of memory. You can find related parts by using the part number A3P600L, which is its base part number. The FPGA module's RAM si13.5kBe reaches 13.5kB in order to ensure that the program operates in a normal manner. This cable has 208 pins and is designed to connect to a computer. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. In this module, 70°C is the maximum operating temperature at which fpga electronics can operate. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. Fpga semiconductor is made up of 600000 gates as fpga semiconductors basic building block. The structure of the registers used to store and transfer data consists of 13824 registers. The maximum supply voltage it supports is 1.26V. With a minimum supply voltage of 1.14V, it can operate. A FPGA of this type can achieve a speed as high as 892.86MHz. The supply current used for its operation is 5mA. 208-PQFP (28x28) stands for its supplier device package.

A3P600L-1PQ208 Features

154 I/Os
Up to 110592 RAM bits
208 LABs/CLBs
70°C gates
13824 registers

A3P600L-1PQ208 Applications

There are a lot of Microsemi Corporation A3P600L-1PQ208 FPGAs applications.

• Security systems
• Automotive
• Military Temperature
• Telecommunication
• Distributed Monetary Systems
• ASIC prototyping
• Image processing
• Secure Communication
• Automotive driver's assistance
• Filtering and communication encoding