FPGAs Fusion? Series 180-WFQFN Dual Rows, Exposed Pad
SOT-23
AFS090-2QNG180 Datasheet
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
180-WFQFN Dual Rows, Exposed Pad
Supplier Device Package
180-QFN (10x10)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2013
Series
Fusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Voltage - Supply
1.425V~1.575V
Base Part Number
AFS090
Number of I/O
60
Total RAM Bits
27648
Number of Gates
90000
AFS090-2QNG180 Product Details
AFS090-2QNG180 Overview
The package that contains this software is called 180-WFQFN Dual Rows, Exposed Pad. Its 60 I/Os help it transfer data more efficiently. This FPGA module can be attached to the development board with a Surface Mount. This device is powered by a 1.425V~1.575V battery. The Fusion? Series is one of the types of FPGAs that belong to this type. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. As a result of space limitations, this FPGA model has been included in Tray. This device has 27648 RAM bits, which is the number of RAM bits that this device offers. Parts related to this part can be found using its base part number AFS090. Its basic building block contains 90000 gates. There is a device package provided by 180-QFN (10x10) as its supplier.
AFS090-2QNG180 Features
60 I/Os Up to 27648 RAM bits
AFS090-2QNG180 Applications
There are a lot of Microsemi Corporation AFS090-2QNG180 FPGAs applications.